Co-packaged Optics & Photonics Packaging
•17 stocks
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5Y Price (Market Cap Weighted)
All Stocks (17)
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| Company | Market Cap | Price |
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Co-packaged Optics & Photonics Packaging is a packaging solution jointly integrating optical components with electronics for data centers.
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$1.46T |
$280.66
-6.43%
|
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Marvell is advancing co-packaged optics/photonics packaging to integrate optical+electronic dies for high-bandwidth interconnects.
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$73.81B |
$85.61
-7.92%
|
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Co-packaged Optics & Photonics Packaging captures Teledyne’s packaging approach for optics and photonics integrated with electronics.
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$26.59B |
$567.44
-1.70%
|
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Co-packaged Optics & Photonics Packaging aligns with ST's packaging for data-center optical interconnects.
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$25.62B |
$27.63
-1.34%
|
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Co-packaged Optics & Photonics Packaging is a differentiator in data-center/AI infrastructure packaging.
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$20.82B |
$193.99
-5.75%
|
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Co-packaged Optics & Photonics Packaging aligns with UMC's packaging differentiation to support high-bandwidth data center applications.
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$17.99B |
$7.18
-4.01%
|
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Co-packaged optics and photonics packaging technology being developed for advanced interconnects.
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$10.60B |
$152.75
-5.99%
|
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Co-packaged Optics & Photonics Packaging is part of their advanced packaging capabilities, enabling higher bandwidth and power delivery for AI/HPC.
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$9.78B |
$11.08
-5.38%
|
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Co-packaged optics & photonics packaging solutions are part of MKS's integrated packaging approach leveraging PSD and MSD capabilities.
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$8.13B |
$121.26
-10.13%
|
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Co-packaged optics/photonic packaging is a strategic frontier.
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$6.98B |
$28.26
-9.09%
|
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Co-packaged optics & photonics packaging aligns with their optical modules and data-center packaging.
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$6.56B |
$122.71
-5.87%
|
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EchoScan and related packaging/interconnect inspection capabilities align with co-packaged optics/photonics packaging themes.
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$5.93B |
$121.34
-11.77%
|
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Co-packaged Optics & Photonics Packaging reflects IPG's involvement in packaging photonics for integrated systems.
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$3.43B |
$80.68
-7.23%
|
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Co-packaged optics & photonics packaging tooling for high-bandwidth data center packaging is part of ACMR's advanced packaging offerings.
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$2.34B |
$36.59
-11.08%
|
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Co-packaged Optics & Photonics Packaging reflects KLIC's move into integrated optical-electronic packaging for high-bandwidth applications.
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$2.19B |
$40.89
-1.47%
|
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BHE has capabilities in co-packaged optics & photonics packaging for data-center-grade systems.
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$1.30B |
$35.97
-4.36%
|
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Co-packaged Optics & Photonics Packaging aligns with POET packaging optical engine dies with electronic dies for data-center efficiency.
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$535.73M |
$7.63
-10.39%
|
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