On October 18, 2024, Helix Microinnovations LLC initiated a patent infringement lawsuit against Analog Devices, Inc. in the Eastern District of Texas. The lawsuit alleges infringement of a 'chip-on-board' (COB) packaging patent, specifically patent 7,238,550.
The plaintiff claims that Analog Devices' QFN (quad-flat no lead) packages, including those from Maxim, which Analog Devices acquired in 2020, infringe upon the asserted patent. The accused products are described as being fabricated using epoxy resins.
This litigation campaign by Helix Microinnovations LLC targets multiple semiconductor companies. The asserted patent, issued in July 2007, relates to chip-on-board logic modules.
The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.