Applied Materials, Inc. has acquired a 9% stake in BE Semiconductor Industries (BESI), a leading manufacturer of assembly equipment for the semiconductor industry, making Applied Materials its largest shareholder. This strategic, long-term investment reinforces a collaboration that began in 2020.
The companies recently extended their agreement to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is a critical technology for advanced packaging of semiconductors, enabling increased density and improved performance, power consumption, and cost for advanced logic and memory chips foundational to AI.
Terry Lee, Corporate Vice President at Applied Materials, stated that this investment demonstrates the company's commitment to co-developing the most capable hybrid bonding solution. The integrated system combines Applied Materials' expertise in front-end wafer processing with BESI's bonding accuracy and speed, aiming for high-volume manufacturing over the next several years.
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