iPronics, a pioneer in software-defined photonics, announced a collaboration with Ansys to advance the development of high-performance optical technologies for AI and cloud data centers. This partnership merges iPronics’ cutting-edge design of fabrication-tolerant photonic components with Ansys’ powerful multiphysics simulation tools. The goal is to bring greater reliability to AI infrastructure and data centers.
iPronics integrates Ansys solutions across its core development workflow, encompassing optical layout, packaging, and thermal simulations. This comprehensive approach enables robust, full-stack design and validation of photonic integrated circuits (PICs) that perform reliably despite fabrication variability. These resilient components are foundational for energy-efficient, low-latency future data center interconnects, which are essential for demanding AI workloads.
As AI models grow in complexity and demand higher data throughput, traditional electronic interconnects face increasing strain from latency, power, and scalability limitations. iPronics’ silicon photonics approach, supported by Ansys simulation, offers a new path forward by delivering programmable, fabrication-tolerant components that scale efficiently across hyperscale deployments, shaping the infrastructure that will support tomorrow’s AI workloads.
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