Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), along with new certifications for its semiconductor solutions, through continued collaboration with TSMC. These advancements aim to facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are also extending tool certification for the newly announced N3C technology.
RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon process A16™ with Super Power Rail, a backside power delivery solution for analog/block-level and SoC-level electromigration (EM) and voltage drop (IR) analysis. A more precise thermal analysis flow was developed for the TSMC A16 process, leveraging TSMC's thermal specifications for accurate temperature calculations. Ansys is also collaborating on design enablement for TSMC's next-generation A14 technology.
For scalable electromagnetic analysis, Ansys introduced HFSS-IC Pro, certified by TSMC for its advanced 5nm and 3nm processes, meeting rigorous accuracy requirements for next-generation semiconductor products. The collaboration also refines COUPE design solutions using AI capabilities in Ansys optiSLang® for PIC optimization and enhances a joint AI-assisted RF migration flow with Synopsys Custom Compiler™ and ASO.ai™ solutions, accelerating the transition between silicon processes.
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