Ansys announced its integration of the NVIDIA Modulus AI framework into its semiconductor simulation products to significantly speed up design optimization. This collaboration aims to enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify optimal design configurations. The technology integration will enhance outcomes for a wide range of products, including GPUs, HPC chips, AI chips, smartphone processors, and advanced analog integrated circuits.
NVIDIA Modulus is a physics-AI framework designed to train and deploy models that combine physics-based domain knowledge with simulation data. This allows users to create customized AI engines tailored to their specific needs. Integrating this framework into the Ansys SeaScape platform will enable customers to use high-fidelity data generated by Ansys tools to train their AI engines, which can then be used for more robust design exploration.
For example, designers can train AI models using their library of completed designs in Ansys RedHawk-SC within the integrated Modulus framework. Once trained, the AI can identify optimal designs based on desired specifications, such as size, power, and performance, in a fraction of the time. Ansys plans to add Modulus-created AI accelerators to its semiconductor solutions, including RedHawk-SC, Totem-SC, PathFinder-SC, and RedHawk-SC Electrothermal, demonstrating over 100x speed-up for thermal simulations.
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