Ansys announced that its thermal and multiphysics signoff tools have received certifications for designs manufactured with Intel 18A process technology. These certifications help ensure the functionality and reliability of advanced semiconductor systems for the most demanding applications, including AI chips, graphic processing units (GPUs), and high-performance computing (HPC) products. Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry's EMIB technology, used for creating multi-die 3D integrated circuit (3D-IC) systems.
Industry-leading solutions like RedHawk-SC and Totem deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors with PowerVia backside power delivery. For scalable electromagnetic analysis, Ansys is introducing HFSS-IC Pro, a new addition to the HFSS-IC product family, which is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.
EMIB facilitates 3D-IC for high-performance microprocessors and heterogeneous integrated systems, enhancing performance and integration. The flow includes thermal reliability analysis with RedHawk-SC Electrothermal. Ansys is also joining the Intel Foundry Chiplet Alliance, part of the Intel Foundry Accelerator Alliance, to help develop a secure ecosystem for designing and manufacturing interoperable chiplets, further deepening its collaboration with Intel Foundry.
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