Alpha and Omega Semiconductor Limited (AOSL) today introduced its AONK40202 25V MOSFET, featuring state-of-the-art DFN3.3x3.3 Source-Down packaging technology. This new MOSFET is designed for high power density in DC-DC applications, specifically meeting the requirements of AI servers and data center power distribution.
The Source-Down packaging technology offers a larger source contact to the PCB and a center gate pin layout, which simplifies routing on the PCB. The AONK40202 provides outstanding current handling capabilities up to 319A with a maximum junction temperature rated at 175°C, delivering significant potential for system-level thermal management improvements.
This MOSFET offers lower on-state resistance (RDS(on)) and enhanced thermal performance compared to traditional Drain-Down packaging solutions, enabling more effective use of PCB space. The AONK40202 is immediately available in production quantities with a lead time of 14-16 weeks, priced at $1.65 in 1,000-piece quantities.
The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.