TSMC Continues Evaluation of ASML's High NA EUV Technology for Future Nodes

ASML
September 21, 2025
Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, is still assessing when it will integrate ASML's cutting-edge High Numerical Aperture (NA) machines into its future process nodes. This indicates a measured approach to adopting the advanced lithography technology. While Intel has already begun using ASML's High NA systems, TSMC's ongoing evaluation suggests that the widespread adoption of this expensive and complex technology may be a more gradual process across the industry's leading players. The timing of TSMC's commitment to High NA EUV is significant, as its decisions often set industry trends for advanced chip manufacturing. Its cautious stance could influence the overall ramp-up timeline for ASML's next-generation machines. The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.