Thermo Fisher Scientific introduced the Helios MX1 Plasma Focused Ion Beam (PFIB) Scanning Electron Microscope (SEM), a fully automated wafer‑analysis system that performs 3‑dimensional reconstruction and metrology, enabling semiconductor manufacturers to examine buried structures directly within fabrication environments.
The MX1 incorporates a multi‑ion species plasma FIB that supports both xenon and argon sources, providing flexibility and optimized milling for a range of materials. Integrated software, including the Cortex web‑based user interface and Metrology Studio, allows users to design recipes, view results, and automate data collection, accelerating time‑to‑data and time‑to‑yield for logic, memory, and advanced packaging devices.
The launch positions Thermo Fisher Scientific to capture a growing demand for in‑line, high‑speed metrology solutions in semiconductor manufacturing. The Helios MX1 targets fab engineers and quality‑control teams seeking rapid, high‑resolution imaging of complex 3‑D structures, addressing challenges such as shrinking geometries and increasingly intricate packaging.
Thermo Fisher Scientific, a global leader in scientific instrumentation with annual revenues exceeding $40 billion, continues to expand its electron‑microscopy portfolio with the Helios MX1, reinforcing its commitment to advanced 3‑D metrology and defect analysis in the semiconductor industry.
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