Lumentum Holdings Inc. showcased several live technology and product demonstrations at ECOC 2025, reinforcing its focus on enabling AI-driven data centers and large communications networks. The company highlighted its cutting-edge photonics and laser chip technologies that drive global network infrastructure.
Among the demonstrations were ELSFP Transceivers for Co-Packaged Optics (CPO) architectures, designed to advance high-bandwidth environments. These modules incorporate Lumentum’s ultra-high-power (UHP) 1310 nm lasers, improving thermal management, reliability, and serviceability, with sampling expected in calendar Q1 2026.
Lumentum also demonstrated its 1.6T DR8 TRO OSFP pluggable transceiver module, providing 8x200 Gbps data connectivity for hyperscale Cloud and AI applications, which is currently ramping into volume production. Additionally, the company is sampling its ultrawideband narrow-linewidth InP nano-iTLA, offering full tunability across more than 12.4 THz for increased bandwidth demand in DCI, metro, and long-haul networks.
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