Lumentum Holdings Inc. unveiled new advancements in foundational indium phosphide (InP) photonic chip technologies at the 2025 Optical Fiber Communications Conference and Exhibition (OFC). These innovations are designed to deliver higher bandwidth and more power-efficient connectivity for next-generation AI-driven data centers.
The company demonstrated 400 Gbps-per-lane photonic technologies poised to enable the 3.2T generation of optical transceivers. Lumentum's 200 Gbps-per-lane InP EMLs are currently available, and the company is developing new 200 Gbps-per-lane differential drive electro-absorption modulated lasers (DD EML) to reduce power dissipation.
Lumentum also showcased its ultra-high power (UHP) 1310 nm DFB lasers for co-packaged optics (CPO) architectures, which are critical for high-density, low-power optical links. The company highlighted its selection as an NVIDIA silicon photonics ecosystem partner, with its UHP lasers integrated into NVIDIA’s Spectrum-X Photonics and Quantum-X Photonics networking switches.
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