Lightwave Logic announced a technical program with a Fortune Global 500 company to co‑develop a custom variant of its Perkinamine electro‑optic polymer, a co‑packaged optics assembly process, and a silicon photonics process development kit (PDK) for 400 Gb/s AI networking. The collaboration will run through the first half of 2026.
The partnership marks the company’s first major customer win for its polymer technology and signals a shift from material supply and licensing toward integrated device solutions. By working with a large enterprise, Lightwave Logic will validate the polymer’s performance under commercial manufacturing conditions and accelerate adoption by silicon photonics foundries and device manufacturers.
The collaboration is a material step in Lightwave Logic’s commercialization strategy. It could open new revenue streams and strengthen its competitive position against established silicon photonics players. The company’s proprietary Perkinamine polymer offers advantages in speed and power consumption, and the development of a PDK is critical for scaling integration into standard silicon photonics design flows.
CEO Yves LeMaitre said the partnership demonstrates the technology’s superior performance and compatibility with industry roadmaps for integration and co‑packaging. He emphasized that the polymer is designed to work with processes and equipment available at semiconductor foundries, positioning the company to capture a growing AI networking market.
The announcement follows Lightwave Logic’s Q3 2025 earnings, which reported sales of $0.029166 million and a net loss of $5.1 million. The company has $34.942 million in cash and cash equivalents, providing a runway through March 2027, and it has been raising capital through equity programs, including ATM sales.
While the terms of the agreement were not disclosed, the partnership represents a significant milestone for a company that has previously secured a second Fortune 500 customer. The program’s focus on 400 Gb/s CPO applications aligns with the increasing demand for higher data rates and lower power consumption in AI and data center environments.
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