MACOM entered into a licensing and manufacturing agreement with HRL Laboratories to license and produce HRL’s proprietary 40 nm T3L GaN‑on‑SiC process technology. The partnership will transfer the advanced process from HRL’s research facility to one of MACOM’s U.S. Trusted Foundry sites, expanding the company’s GaN manufacturing footprint.
The 40 nm T3L process is a high‑power, high‑frequency technology that has been matured under U.S. Department of Defense programs such as OUSD STARRY NITE and DARPA DREaM. By adding this process to its portfolio, MACOM can accelerate the development of next‑generation RF and power devices that meet the demanding performance requirements of its core customers in defense, data‑center, and telecom markets.
The agreement complements MACOM’s existing 150 mm GaN‑on‑SiC line, allowing the company to offer a broader range of device geometries and performance envelopes. The new process will enable higher operating frequencies and lower losses, positioning MACOM to compete more directly with industry leaders like Qorvo and Wolfspeed in the high‑performance segment.
MACOM’s use of U.S. Trusted Foundry sites underscores the company’s commitment to secure, domestic manufacturing—a key consideration for defense customers and a growing trend in the semiconductor supply chain. The partnership also signals MACOM’s intent to strengthen its presence in the U.S. market while leveraging HRL’s expertise in transitioning advanced processes to production.
Stephen G. Daly, President and CEO of MACOM, said the T3L process is “one of the most advanced high‑frequency semiconductor processes in the industry, which we anticipate will enhance our existing portfolio and accelerate execution of our roadmap.” Rob Vasquez, President and CEO of HRL, highlighted the collaboration as a demonstration of HRL’s ability to move technology concepts into production.
Financial terms of the licensing agreement, including upfront payments, royalties, and revenue‑sharing arrangements, have not been disclosed. The specific Trusted Foundry facility that will host the production line has not been named, and a detailed timeline for the process transfer and full operational rollout has not been provided. However, both parties have indicated that the transfer will be rapid, with production expected to begin in the near term.
The partnership is expected to benefit key customer segments. Defense contractors will gain access to higher‑performance RF and power modules, while data‑center operators can leverage the technology for more efficient 5G/6G infrastructure. Telecom vendors will also be able to incorporate the process into next‑generation base‑station components.
Overall, the licensing deal strengthens MACOM’s compound‑semiconductor portfolio, accelerates its product roadmap, and positions the company to capture growth in high‑performance markets that demand secure, domestic manufacturing and cutting‑edge GaN technology.
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