On October 20, 2025, Nvidia announced it produced its first Blackwell wafer in the United States at TSMC’s Phoenix, Arizona facility. The wafer is the base material for Nvidia’s next‑generation Blackwell AI chips, designed to improve performance while reducing energy consumption and cost.
The ceremony saw Nvidia CEO Jensen Huang and TSMC vice president of operations YL Wang sign the wafer, marking the first time the most advanced AI chip has been manufactured in the U.S. by the most advanced fab. Huang said it was a historic moment and a testament to U.S. manufacturing capabilities.
The move is expected to strengthen the U.S. semiconductor supply chain and reduce reliance on international shipments. Nvidia plans to continue expanding its AI infrastructure investments in the U.S., working with TSMC, Foxconn, and other partners to build domestic AI capabilities.
This milestone could provide Nvidia with greater control over production timelines and mitigate geopolitical risks, potentially enhancing its competitive position in the AI chip market.
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