nVent announced a new portfolio of modular liquid‑cooling solutions designed to support next‑generation AI chips, with row‑ and rack‑based coolant distribution units (CDUs) and advanced manifold technology that can be integrated into existing data‑center infrastructure.
The company highlighted its partnership with Siemens to develop a joint reference architecture for liquid cooling and power, and its participation in Google‑led Project Deschutes, a standard for liquid‑cooling data‑center design. The new products were showcased at SC25, underscoring nVent’s commitment to industry collaboration and standardization.
The launch addresses a critical demand in the AI data‑center market, where power densities of new chips exceed the cooling capacity of traditional air‑based systems. By offering modular, scalable cooling that can be retrofitted into current racks, nVent positions itself to capture a share of the growing hyperscale facility market, which is projected to expand as AI workloads continue to proliferate.
nVent’s recent financial performance supports the strategic importance of this product line. In the third quarter of 2025, the company reported record sales and adjusted earnings per share, with organic orders up sharply due to AI data‑center projects. Revenue grew 12% year‑over‑year, and the data‑center solutions segment saw a 20% increase in orders, reflecting strong demand for high‑density, energy‑efficient cooling. The new portfolio is expected to contribute materially to future revenue growth as hyperscale operators seek to reduce power usage effectiveness (PUE) and expand AI capacity.
Eric Osborn, GM of nVent Data Solutions, said the company’s “deep technical expertise and collaborative approach” enabled the rapid development of these solutions, “solving customer challenges and reinforcing our long‑standing commitment to innovation for next‑generation AI chips.”
While competitors such as NVIDIA, Lenovo, HPE, and AMD also offer cooling solutions, nVent differentiates itself with modularity, ease of integration, and a focus on end‑to‑end protection, connectivity, and cooling for mission‑critical environments. The partnership with Siemens and adherence to Project Deschutes standards further strengthen its market position.
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