Onto Innovation Inc. announced significant advancements in its product suite for 3D interconnect process control, introducing the new 3Di technology on its Dragonfly G3 system. This technology is designed for bump process control in high bandwidth memory (HBM) and advanced logic applications, with initial orders already secured from a top HBM manufacturer, a tier one OSAT, and a leading bump process equipment manufacturer.
The company also launched the EchoScan system, a unique technology for detecting voids as small as 1µm in wafer bonding applications, particularly crucial for hybrid bonding for Cu-Cu interconnects. The first EchoScan system is scheduled to ship in the first quarter of 2025, with additional tools planned for customers throughout the year, offering immersion-free, non-contact void detection at high volume manufacturing speeds.
In a major customer win, Onto Innovation finalized a $69 million volume purchase agreement with a leading DRAM manufacturer for its optical metrology ecosystem, including common films, optical critical dimension, and integrated metrology. Deliveries for this agreement are set to begin in the first quarter of 2025, supporting expectations for a recovery in the DRAM market.
Furthermore, Onto Innovation introduced the Iris G2 system, a single platform film metrology system for common and critical films in advanced node, mature, and specialty device applications. This system targets the critical films market, estimated at approximately $400 million in 2025, with its first shipment also scheduled for the first quarter of 2025.
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