PDF Solutions, Inc. announced today a landmark multi‑year agreement with a major global semiconductor manufacturer to deploy its eProbe® tools, Characterization Vehicle® infrastructure, and Exensio® analytics software across several high‑volume manufacturing facilities. The contract, which expands a prior engagement, will see the installation of multiple eProbe systems beginning in 2025, supported by PDF Solutions’ secureWISE® network for secure remote equipment support and maintenance.
The deal leverages eProbe’s contact‑less electron‑beam testing of 3D semiconductor structures, optimized for each wafer’s design characteristics. It also incorporates the eProbe DirectScan™ application, Characterization Vehicle test chips, and Exensio analytics to enable faster yield learning and root‑cause analysis at parts‑per‑billion levels. The secureWISE® connectivity will provide continuous, secure remote monitoring and data transfer across the manufacturer’s fabs.
This contract validates PDF Solutions’ integrated process‑characterization and analytics approach, expands its footprint in high‑volume manufacturing, and supports its reaffirmed full‑year 2025 revenue growth guidance of 21% to 23%. The win demonstrates commercial traction for eProbe technology and positions PDF Solutions to capture additional revenue from advanced‑node development and high‑volume production.
The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.