SkyWater Technology has chosen YES RapidCure polymer dielectric curing systems for its implementation of M-Series™ fan-out wafer level packaging (FOWLP) technology. This initiative is in partnership with Deca Technologies.
The adoption of these systems supports SkyWater's expansion into advanced packaging capabilities. This move is part of the company's strategy to enhance its offerings in heterogeneous integration solutions.
This operational milestone strengthens SkyWater's position in specialized semiconductor manufacturing. It also aligns with its focus on co-developing differentiated IP and transitioning it to production.
The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.