STMicroelectronics announced on December 11, 2024, the introduction of the ST67W611M1, the first product from its strategic collaboration with Qualcomm Technologies. This module is designed to simplify the development of next-generation wireless solutions for industrial and consumer IoT applications.
The ST67W611M1 module integrates a Qualcomm QCC743 multiprotocol connectivity system-on-a-chip (SoC), offering Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo capabilities. It is designed for easy integration with any STM32 microcontroller or microprocessor and will support the Matter protocol over Wi-Fi for future-proof connectivity.
The module includes 4Mbyte Flash for code and data storage, a 40MHz crystal, and an integrated PCB antenna or micro RF connector for an external antenna. Samples of the ST67W611M1 are currently available, with OEM availability expected in Q1 2025 and broader availability in Q2 2025.
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