STMicroelectronics launched the GANSPIN GaN IC platform, a new family of power devices that combine high efficiency and a compact form factor, targeting motor‑driven appliances and industrial drives.
The platform includes two devices, GANSPIN611 and GANSPIN612, each capable of driving motors up to 400 W. They come in a 9 mm × 9 mm thermally enhanced QFN package and start at $4.44. On‑resistance values of 138 mΩ and 270 mΩ allow higher power density and lower self‑heating, enabling PCB footprints to shrink by up to 60 % and reducing BOM costs.
The system‑in‑package design eliminates the need for external heatsinks, cuts electromagnetic noise, and improves switching performance. The launch is aimed at white‑goods, power tools, and factory automation, sectors that are tightening energy‑efficiency standards and seeking smaller, cheaper motor‑control solutions.
The new platform fits into STMicroelectronics’ broader wide‑bandgap strategy, which the company has been expanding through GaN and SiC products. In its Q3 2025 earnings, the company reported revenue that beat expectations and an EPS beat, but gross margin slipped year‑over‑year due to product‑mix pressures in Automotive and Industrial segments. CEO Jean‑Marc Chery said the company is optimizing investments and reshaping its manufacturing footprint to improve operational efficiency and cash flow, signaling confidence that the new GaN portfolio will help lift margins in the coming quarters.
While the launch itself does not yet generate revenue, it represents a key operational milestone that positions STMicroelectronics to capture a growing market for high‑efficiency motor drives. The company’s outlook for Q4 2025 projects sequential revenue growth and an improved gross margin, suggesting that the new GaN platform could contribute to a rebound in profitability as the company leverages its expanded wide‑bandgap portfolio.
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