On October 24, 2025, United Microelectronics Corporation (UMC) announced the release of its 55nm Bipolar‑CMOS‑DMOS (BCD) platform, a new process node that integrates analog, digital, and power functions on a single chip.
The 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling more efficient power‑management solutions for smartphones, wearables, automotive electronics, smart homes, and industrial factories.
By adding the 55nm node to its existing BCD portfolio that spans from 0.35µm down to 55nm, UMC expands its specialty technology offering and strengthens its competitive position in the high‑efficiency power‑IC market, potentially opening new revenue streams for the company.
UMC operates 12 fabs worldwide, with a combined capacity of over 400,000 wafers per month, and all facilities are certified with IATF 16949 automotive quality standards, underscoring the company’s readiness to support automotive and other high‑reliability customers with the new platform.
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