Valens Semiconductor announced on November 10 that three unnamed original equipment manufacturers will launch endoscopes powered by its VA7000 chipset, marking the first medical‑imaging products to use the chip. The new devices include a laparoscope, a 3‑D imaging solution for robotic surgeries, and a single‑use colonoscope that delivers 4K video resolution.
The VA7000 delivers built‑in electrosurgical noise cancellation and multi‑gigabit connectivity over ultra‑thin coax and UTP cables, enabling high‑resolution video in a compact form factor. It is the first MIPI A‑PHY‑compliant chipset, a standard that supports high‑speed sensor connectivity in demanding applications such as automotive and medical imaging.
By entering the medical‑imaging market, Valens extends its reach beyond its core Pro‑AV and automotive businesses and opens a potential new revenue stream. The disposable endoscope market is projected to grow into billions of dollars by 2030, and the VA7000’s features address sterilization and reprocessing challenges that limit reusable endoscopes.
The endoscopes will be showcased at the Medica trade show in Düsseldorf from November 17‑20. Valens has not yet disclosed the specific launch dates or the OEM partner names; the company said that launch dates will be announced later.
Valens’ Q2 2025 revenue of $17.1 million exceeded guidance, and the company updated its full‑year 2025 revenue outlook to $66 million‑$71 million. Management highlighted early traction in the medical‑imaging space, noting that leading companies are approaching Valens to adopt the VA7000, which signals confidence in the technology’s ability to meet stringent medical requirements.
Regulatory approvals for the new endoscopes have not been announced, and the competitive landscape includes established reusable endoscope manufacturers. Valens’ VA7000 offers a competitive edge for disposable solutions through its high‑speed, low‑noise design.
The announcement signals Valens’ strategic diversification and the potential for a new revenue stream, but key details such as launch timing and OEM partners remain pending.
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