Valens Semiconductor announced its entry into the medical industry with a high-performance connectivity solution for next-generation single-use endoscopes. The company will display innovative solutions, including a chip based on its VA7000 chipset, at Medica 2024.
The VA7000-based solution offers exceptional EMC reliability during electrosurgery, high-resolution and wide field-of-view video, a small form factor, and low power consumption. These features are optimized for high-performance single-use endoscopy, a growing segment within the endoscopy vertical.
The disposable endoscope market in the US is projected to grow at a 17% CAGR, reaching an estimated $7.32 billion by 2030. Valens' solution, which includes a built-in electrosurgical noise canceller, addresses a major roadblock that has prevented the industry's transition to disposable endoscope architecture.
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